IEEE Transactions on Dielectrics and Electrical Insulation

Publication Information

Title
IEEE Transactions on Dielectrics and Electrical Insulation [English]
ISSNs
  • Print: 1070-9878
  • Electronic: 1558-4135
URL
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp/?punumber=94
Publishers
Institute of Electrical and Electronics Engineers [Society Publisher]

Publisher Policy

Open Access pathways permitted by this journal's policy are listed below by article version. Click on a pathway for a more detailed view.

Published Version

NoneCC BY
Journal Website
OA Fee
This pathway has an Open Access fee associated with it
OA Publishing
This pathway includes Open Access publishing
Embargo
No Embargo
Licence
  • CC BY
  • CC BY-NC-ND
Copyright Owner
Authors
Location
Journal Website
Notes
Authors must contact publisher stating Creative Commons Attribution requirement

Accepted Version

[pathway a]

None
Institutional Repository, arXiv, TechRxiv, +2
Embargo
No Embargo
Copyright Owner
Publishers
Location
  • Author's Homepage
  • Institutional Repository
  • Institutional Website
  • Named Repository (arXiv, TechRxiv)
Conditions
  • When accepted for publication, set statement to accompany deposit (see policy)
  • Must link to publisher version with DOI
  • Publisher copyright and source must be acknowledged

Accepted Version

[pathway b]

24m
Funder Designated Location
Embargo
24 Months
Location
Funder Designated Location
Conditions
  • When accepted for publication, set statement to accompany deposit (see policy)
  • Publisher copyright and source must be acknowledged
Notes
IEEE recognizes that posting requirements and embargo periods vary by funder, and IEEE authors may comply with requirements to deposit their accepted articles in funding repositories where the embargo is less than 24 months

Submitted Version

[pathway a]

None
Institutional Repository, arXiv, Funder Designated Location, +4
Embargo
No Embargo
Location
  • Author's Homepage
  • Funder Designated Location
  • Institutional Repository
  • Institutional Website
  • Named Repository (arXiv, TechRxiv)
  • Preprint Repository
Conditions
  • Must be replaced with accepted version
  • When submitted, set statement to accompany deposit (see policy)
  • When accepted for publication, set statement to accompany deposit (see policy)
  • IEEE must be informed as to the electronic address of the pre-print
  • Publisher copyright and source must be acknowledged

Submitted Version

[pathway b]

None
Academic Social Network
Embargo
No Embargo
Location
Academic Social Network
Conditions
Must be removed upon acceptance for publication
Notes
Academic Social Network must be a signatory of STM Sharing Principles

For more information, please see the following links:

Record Information

ID
3438
Date Created
22 July 2010 13:08:53 UTC
Last Modified
21 July 2021 13:25:18 UTC
URI
https://v2.sherpa.ac.uk/id/publication/3438

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